Method of manufacturing a semiconductor device and a semiconductor device

ABSTRACT

In a method of manufacturing a semiconductor device, a fin structure having a channel region protruding from an isolation insulating layer disposed over a semiconductor substrate is formed, a cleaning operation is performed, and an epitaxial semiconductor layer is formed over the channel region. The cleaning operation and the forming the epitaxial semiconductor layer are performed in a same chamber without breaking vacuum.

RELATED APPLICATIONS

This application claims priority to U.S. Provisional Application No.63/024,377 filed on May 13, 2020, the entire contents of which areincorporated herein by reference.

BACKGROUND

As the semiconductor industry has progressed into nanometer technologyprocess nodes in pursuit of higher device density, higher performance,and lower costs, challenges from both fabrication and design issues haveresulted in the development of three-dimensional designs, such as a finfield effect transistor (Fin FET). Fin FET devices typically includesemiconductor fins with high aspect ratios and in which channel andsource/drain regions of semiconductor transistor devices are formed. Agate is formed over and along the sides of the fin structure (e.g.,wrapping) utilizing the advantage of the increased surface area of thechannel and source/drain regions to produce faster, more reliable andbetter-controlled semiconductor transistor devices. In some devices,channel regions of an n-type FET and a p-type FET are made of differentmaterials.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is best understood from the following detaileddescription when read with the accompanying figures. It is emphasizedthat, in accordance with the standard practice in the industry, variousfeatures are not drawn to scale and are used for illustration purposesonly. In fact, the dimensions of the various features may be arbitrarilyincreased or reduced for clarity of discussion.

FIG. 1 shows one of the various stages of a sequential manufacturingoperation of a semiconductor FET device according to an embodiment ofthe present disclosure.

FIG. 2 shows one of the various stages of a sequential manufacturingoperation of a semiconductor FET device according to an embodiment ofthe present disclosure.

FIG. 3 shows one of the various stages of a sequential manufacturingoperation of a semiconductor FET device according to an embodiment ofthe present disclosure.

FIG. 4 shows one of the various stages of a sequential manufacturingoperation of a semiconductor FET device according to an embodiment ofthe present disclosure.

FIG. 5 shows one of the various stages of a sequential manufacturingoperation of a semiconductor FET device according to an embodiment ofthe present disclosure.

FIG. 6 shows one of the various stages of a sequential manufacturingoperation of a semiconductor FET device according to an embodiment ofthe present disclosure.

FIG. 7 shows one of the various stages of a sequential manufacturingoperation of a semiconductor FET device according to an embodiment ofthe present disclosure.

FIG. 8 shows one of the various stages of a sequential manufacturingoperation of a semiconductor FET device according to an embodiment ofthe present disclosure.

FIG. 9 shows one of the various stages of a sequential manufacturingoperation of a semiconductor FET device according to an embodiment ofthe present disclosure.

FIG. 10 shows one of the various stages of a sequential manufacturingoperation of a semiconductor FET device according to an embodiment ofthe present disclosure.

FIGS. 11A and 11B show one of the various stages of a sequentialmanufacturing operation of a semiconductor FET device according to anembodiment of the present disclosure.

FIGS. 12A, 12B, 12C and 12D show various stages of a sequentialmanufacturing operation of a semiconductor FET device according to anembodiment of the present disclosure.

FIG. 13 shows a flow chart of forming a cap semiconductor layeraccording to an embodiment of the present disclosure.

FIG. 14 shows an apparatus used for manufacturing a semiconductor deviceaccording to an embodiment of the present disclosure.

FIG. 15 shows a condition of cleaning and forming an epitaxial layeraccording to an embodiment of the present disclosure.

FIGS. 16A, 16B, 16C, 16D, 16E and 16F show various stages of asequential manufacturing operation of a semiconductor FET deviceaccording to an embodiment of the present disclosure.

FIGS. 17A and 17B show advantageous effects of the embodiments of thepresent disclosure.

FIGS. 18A and 18B show cross sectional views of the semiconductor deviceaccording to embodiments of the present disclosure.

DETAILED DESCRIPTION

It is to be understood that the following disclosure provides manydifferent embodiments, or examples, for implementing different featuresof the disclosure. Specific embodiments or examples of components andarrangements are described below to simplify the present disclosure.These are, of course, merely examples and are not intended to belimiting. For example, dimensions of elements are not limited to thedisclosed range or values, but may depend upon process conditions and/ordesired properties of the device. Moreover, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed interposing the first and second features, suchthat the first and second features may not be in direct contact. Variousfeatures may be arbitrarily drawn in different scales for simplicity andclarity.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly. In addition, the term“made of” may mean either “comprising” or “consisting of” In the presentdisclosure, a phrase “one of A, B and C” means “A, B and/or C” (A, B, C,A and B, A and C, B and C, or A, B and C), and does not mean one elementfrom A, one element from B and one element from C, unless otherwisedescribed. Materials, configurations, processes and/or methods explainedwith respect to one or more figures and/or embodiments can be applied toother figures and/or embodiments, and detailed description thereof maybe omitted for simplicity.

FIGS. 1-11B show views of various stages of a sequential manufacturingoperation of a semiconductor device according to the present disclosure.It is understood that additional operations may be provided before,during, and after the processes shown by FIGS. 1-11B, and some of theoperations described below can be replaced or eliminated for additionalembodiments of the method. The order of the operations/processes may beinterchangeable.

As shown in FIG. 1 , a part of a substrate 10 made of a firstsemiconductor material, in which one or more p-type FETs aresubsequently formed, is etched to form a recess by one or morelithography and etching operations, and the recess is filled with asecond semiconductor material. In one embodiment, the substrate 10includes a single crystalline semiconductor layer on at least it surfaceportion. The substrate 10 may include a single crystalline semiconductormaterial such as, but not limited to Si, Ge, SiGe, GaAs, InSb, GaP,GaSb, InAlAs, InGaAs, GaSbP, GaAsSb and InP. In this embodiment, thesubstrate 10 is made of Si. The substrate 10 may include various regionsthat have been suitably doped with impurities (e.g., p-type or n-typeconductivity). The dopants are, for example boron (BF₂) for an n-typeFin FET and phosphorus for a p-type Fin FET.

As shown in FIG. 1 , an epitaxial layer 11 made of the secondsemiconductor material is formed in the recess. In some embodiments, theepitaxial layer 11 is made of SiGe. In some embodiments, the germaniumconcentration of the SiGe layer 11 is in a range from about 5 atomic %to about 40 atomic % and in other embodiments, the germaniumconcentration of the SiGe layer 11 is in a range from about 10 atomic %to about 30 atomic %. In some embodiments, the SiGe layer 11 is dopedwith a p-type dopant (e.g., boron). In some embodiments, one or morebuffer layer having a lower Ge concentration than the epitaxial layer 11is formed between the epitaxial layer 11 and the substrate 10. The SiGelayer 11 can be formed by chemical vapor deposition (CVD), such as lowpressure CVD (LPCVD) and plasma enhanced CVD (PECVD), molecular beamepitaxy (MBE), atomic layer deposition (ALD), or other suitable process.

Further, as shown in FIG. 2 , a mask layer 15 is formed over thesubstrate 10 and the epitaxial layer 11. In some embodiments, the masklayer 15 includes a first mask layer 15A and a second mask layer 15B.The first mask layer 15A is a pad oxide layer made of a silicon oxide,which can be formed by a thermal oxidation. The second mask layer 15B ismade of a silicon nitride (SiN), which is formed by CVD, PVD, ALD, orother suitable process.

Next, as shown in FIG. 3 , the mask layer 15, the substrate 10 and theepitaxial layer 11 in the p-type region are patterned by using thepatterned mask layer, thereby forming fin structures 12N and 12P(collectively fin structures 12) extending in the Y direction. In someembodiments, the fin structures 12N are for an n-type FET, and the finstructures 12P are for a p-type FET. In FIG. 3 , three n-type finstructures 12N and two p-type fin structures are arranged in the Xdirection. However, the number of the fin structures is not limited totwo or three, and may be as small as one and four or more. In someembodiments, one or more dummy fin structures 12D are formed on one orboth sides of the fin structures 12 to improve pattern fidelity in thepatterning operations.

The fin structures 12 can be patterned by any suitable method. Forexample, the fin structures may be patterned using one or morephotolithography processes, including double-patterning ormulti-patterning processes. Generally, double-patterning ormulti-patterning processes combine photolithography and self-alignedprocesses, allowing patterns to be created that have, for example,pitches smaller than what is otherwise obtainable using a single, directphotolithography process. For example, in one embodiment, a sacrificiallayer is formed over a substrate and is patterned using aphotolithography process. Spacers are formed alongside the patternedsacrificial layer using a self-aligned process. The sacrificial layer isthen removed, and the remaining spacers, or mandrels, may then be usedto pattern the fin structures. The multi-patterning processes combiningphotolithography and self-aligned processes generally result in forminga pair of fin structures. The width of the fin structure 12 is in arange of about 5 nm to about 40 nm in some embodiments, and is in arange of about 7 nm to about 15 nm in certain other embodiments. Theheight of the fin structure 12 is in a range of about 100 nm to about300 nm in some embodiments, and is in a range of about 50 nm to 100 nmin other embodiments. The space between the fin structures 12 is in arange of about 5 nm to about 80 nm in some embodiments, and may be in arange of about 7 nm to 20 nm in other embodiments. In some embodiments,a pitch of the fin structures is in a range from about 10 nm to 120 nm,and is in a range from about 14 nm to about 35 nm in other embodiments.One skilled in the art will realize, however, that the dimensions andvalues recited throughout the descriptions are merely examples, and maybe changed to suit different scales of integrated circuits.

In some embodiments, a plurality of fin structures having a constantpitch are formed and then some of the fin structures are removed toobtain the structure shown in FIG. 3 . In some embodiments, some of thefin structures are cut into pieces for respective FETs.

In some embodiments, the p-type fin structures 12P are arranged with afirst pitch P1, and three n-type fin structures 12N are arranged with asecond pitch P2 and a third pitch P3. In some embodiments, the firstpitch P1 is a minimum pitch (P0) for the fin structures defined by adesign rule. In some embodiments, the second pitch P2 is greater thanthe first pitch P1 and is equal to 2P0 or 3P0. In some embodiments, thethird pitch P3 is greater than the second pitch P2 and is equal to 3P0,4P0 or 5P0. In some embodiments, the fourth pitch P4 between the n-typefin structure 12N and the p-type fin structure 12P and the fifth pitchP5 between the p-type fin structure 12P and the dummy fin structure 12Dare greater than the first pitch P1 and is equal to 2P0, 3P0, 4P0, 5P0or more.

After the fin structures 12 are formed, a first dielectric layer 30 isformed over the fin structures 12 as shown in FIG. 4 . The firstdielectric layer 30 includes one or more layers of insulating materialssuch as silicon oxide, silicon oxynitride, silicon nitride, SiOC, SiCNor SiOCN, formed by LPCVD (low pressure chemical vapor deposition),plasma-CVD or atomic layer deposition (ALD), or any other suitable filmformation method. In certain embodiments, silicon oxide is used as thefirst dielectric layer 30. In some embodiments, as shown in FIG. 4 , thefirst dielectric layer 30 is conformally formed over the fin structures12 such that a space is formed between adjacent fin structures 12,except for the p-type fin structures 12P. For the p-type fin structures12P, since the space between the fin structures is small, the firstdielectric layer fully fills the space therebetween as shown in FIG. 4 .The thickness of the first dielectric layer 30 is adjusted so that thespace between the fin structures (e.g., n-type fin structures with thesecond pitch) is in a range of about 5 nm to about 40 nm in someembodiments, and is in a range of about 7 nm to about 15 nm in certainembodiments.

In some embodiments, one or more liner dielectric layers 18 are formedbetween the first dielectric layer 30 and the fin structures as shown inFIG. 4 . In some embodiments, the liner dielectric layer 18 is made of adifferent material than the first dielectric layer 30 and includes oneor more layers of insulating materials such as silicon oxide, siliconoxynitride, silicon nitride, SiOC, SiCN or SiOCN formed by LPCVD,plasma-CVD or ALD, or any other suitable film formation method. Thethickness of the liner dielectric layer 18 is in a range from about 1 nmto about 5 nm in some embodiments.

After the first dielectric layer 30 is formed, a second dielectric layer35 is formed over the first dielectric layer 30, as shown in FIG. 5 .The material of the second dielectric layer 35 is different from thematerial of the first dielectric layer 30 and, in some embodiments, isalso different from the material of the liner dielectric layer 18. Insome embodiments, the second dielectric layer 35 includes one or morelayers of insulating materials such as silicon oxide, siliconoxynitride, silicon nitride, SiOC, SiCN or SiOCN formed by LPCVD,plasma-CVD or ALD, or any other suitable film formation method. In someembodiments, the second dielectric layer 35 is made of silicon nitride.As shown in FIG. 5 , the second dielectric layer 35 fully fills thefirst space in the n-type fin structures, and covers the top of thefirst dielectric layer 30, in some embodiments. As shown in FIG. 5 , thesecond dielectric layer 35 is conformally formed over the firstdielectric layer where the pitches of the fin structures are large(e.g., equal to or more than 4P0).

In some embodiments, one or more additional dielectric layers 32 areformed between the first dielectric layer 30 and the second dielectriclayer 35 as shown in FIG. 5 . In some embodiments, the additionaldielectric layer 32 is made of a different material than the seconddielectric layer 35 and includes one or more layers of insulatingmaterials such as silicon oxide, silicon oxynitride, silicon nitride,SiOC, SiCN or SiOCN formed by LPCVD, plasma-CVD or ALD, or any othersuitable film formation method. In some embodiments, the additionaldielectric layer 32 is made of a different material than the firstdielectric layer 30. The thickness of the additional dielectric layer 32is in a range from about 1 nm to about 5 nm in some embodiments.

In some embodiments, after the second dielectric layer 35 is formed, aplanarization operation, such as an etch-back process or a chemicalmechanical polishing (CMP) process, is performed to planarize the uppersurface of the second dielectric layer 35.

Next, the second dielectric layer 35 is recessed down below the top ofthe fin structures 12 by using a suitable dry and/or wet etchingoperation, as shown in FIG. 6 . Since the second dielectric layer 35 ismade of a different material than the first dielectric layer 30, thesecond dielectric layer 35 is selectively etched against the firstdielectric layer 30. In some embodiments, the additional dielectriclayer 32 remains on sidewalls of the first dielectric layer 30. As shownin FIG. 6 , a space is formed over the recessed second dielectric layer35 in relatively narrow spaces (e.g., pitch P2, P3) between finstructures. In relatively wide spaces between fin structures (e.g.,pitch P4, P5), the second dielectric layer 35 is fully removed. In someembodiments, the additional dielectric layer 32 is also removed in therelatively wide spaces, and thus, the first dielectric layer 30 isexposed. In some embodiments, the upper surface of the recessed seconddielectric layer 35 has a V-shape or a U-shape.

Further, after the second dielectric layer 35 is recessed, a thirddielectric layer 40 is formed over the first dielectric layer 30, theadditional dielectric layer 32, and the recessed second dielectric layer35, as shown in FIG. 7 . The material of the third dielectric layer 40is different from the materials of the first dielectric layer 30, theadditional dielectric layer 32 and the second dielectric layer 35. Insome embodiments, the third dielectric layer 40 includes a materialhaving a lower etching rate than the second dielectric layer 35 againsta polysilicon etching. In some embodiments, the third dielectric layer40 includes a high-k dielectric material. In some embodiments, the thirddielectric layer 40 includes a dielectric material having a higherdielectric constant (k) than the second dielectric layer 35, theadditional dielectric layer 32 and/or the first dielectric layer 30.When the upper surface of the recessed second dielectric layer 35 has aV-shape or a U-shape, the bottom of the third dielectric layer 40 has aV-shape or a U-shape.

In some embodiments, the third dielectric layer 40 includes one or moreof non-doped hafnium oxide (e.g., HfO_(x), 0<x≤2), hafnium oxide dopedwith one or more other elements (e.g., HfSiO, HfSiON, HfTaO, HfTiO orHfZrO), zirconium oxide, aluminum oxide, titanium oxide, and a hafniumdioxide-alumina (HfO₂—Al₂O₃) alloy. In certain embodiments, hafniumoxide (HfO_(x)) is used as the third dielectric layer 40. The thirddielectric layer 40 can be formed by LPCVD, plasma-CVD or ALD, or anyother suitable film formation method. In some embodiments, the seconddielectric layer 35 is made of silicon nitride. As shown in FIG. 7 , thethird dielectric layer 40 fully fills the relatively narrow spaces andcovers the top of the first dielectric layer 30, in some embodiments. Insome embodiments, after the third dielectric layer 40 is formed, aplanarization operation, such as an etch-back process or a CMP process,is performed to planarize the upper surface of the third dielectriclayer 40. At the relatively wide spaces between fin structures, thethird dielectric layer 40 is conformally formed over the firstdielectric layer 30 and the additional dielectric layer 32, as shown inFIG. 7 .

Next, the third dielectric layer 40 is recessed down below the top ofthe fin structures 12 by using a suitable dry and/or wet etchingoperation, as shown in FIG. 8 . Since the third dielectric layer 40 ismade of a different material than the additional dielectric layer 32 andthe first dielectric layer 30, the third dielectric layer 40 isselectively etched against the additional dielectric layer 32 and thefirst dielectric layer 30. As shown in FIG. 8 , a space is formed overthe recessed third dielectric layer 40. In some embodiments, the uppersurface of the recessed third dielectric layer 30 has a V-shape or aU-shape. At the relatively wide spaces between fin structures, the thirddielectric layer 40 is fully removed and the first dielectric layer 30is exposed, as shown in FIG. 8 .

Then, in some embodiments, a fourth dielectric layer 45 is formed overthe first dielectric layer 30, the additional dielectric layer 32 andthe recessed third dielectric layer 40, as shown in FIG. 9 . In someembodiments, the fourth dielectric layer 45 includes multiple dielectriclayers. In some embodiments, the fourth dielectric layer includes alower layer 42, a middle layer 44 and an upper layer 46. In someembodiments, the materials for the lower, middle and upper layers aredifferent from each other, and in other embodiments, the middle layer ismade of a different material than the lower and the upper layers. Insome embodiments, the fourth dielectric layer 45 is made of a same or adifferent material than the first, second and/or third dielectric layersand includes one or more of silicon oxide, silicon oxynitride, siliconnitride, SiOC, SiCN, or SiOCN formed by LPCVD, plasma-CVD or ALD, or anyother suitable film formation method. In some embodiments, the thicknessof the middle layer 44 is smaller than the thickness of the lower layer42 and the upper layer 46.

Further, as shown in FIG. 9 , a fifth dielectric layer 48 is formed overthe fourth dielectric layer 45, and then a planarization operation, suchas a CMP operation, is performed. In some embodiments, the fifthdielectric layer 48 is made of a different material than the fourthdielectric layer (at least the upper layer 46) and includes one or moreof silicon oxide, silicon oxynitride, silicon nitride, SiOC, SiCN, orSiOCN formed by LPCVD, plasma-CVD or ALD, or any other suitable filmformation method.

Then, as shown in FIG. 10 , a planarization operation is furtherperformed to expose the top of the fin structures 12.

Next, the first dielectric layer 30 and the liner dielectric layer 18formed on side walls of the fin structures are recessed to exposechannel regions of the fin structures, as shown in FIG. 11A. In someembodiments, the first dielectric layer 30 is recessed to about thelevel of the bottom of the SiGe layer 11 (e.g., ±2 nm). The recessedfirst dielectric layer 30 functions as an isolation insulating layer(e.g., shallow trench isolation (STI)) to electrically isolate one finstructure from adjacent fin structures.

By recessing the first dielectric layer a wall fin 50 (dummy dielectricfin) is formed between relatively narrow spaces of the fin structures.As shown in FIG. 11A, the wall fin 50 includes a part of the lower layer42 of the fourth dielectric layer, the recessed third dielectric layer40 formed on the recessed second dielectric layer 35, as a hybrid finstructure. In relatively wide spaces, a wall structure 52 including thefourth dielectric layer 45 and the fifth dielectric layer is formed. Insome embodiments, a part of the additional dielectric layer 32 is alsoincluded in the wall structure 52 and is embedded in the firstdielectric layer 30. In some embodiments, the wall structure 52 does notinclude the second dielectric layer 35 and the third dielectric layer40. In some embodiments, depending on the space widths of adjacent finstructures, the widths of the wall fin structures are different. In someembodiments, when the pitch of the adjacent fin structures is more thanP0 (minimum pitch) and equal to or less than 4P0 (or 3P0), a wall finstructure is formed, and when the pitch of the adjacent fin structuresis more than 4P0 (or 3P0), a wall structure is formed. Whether a wallfin structure or a wall structure is formed also depends on a thicknessof one or more of the first, second or third dielectric layers. In someembodiments, the pitch P6 between the n-type fin structure and the wallfin structure 50 is ½P2. In some embodiments, the space between twon-type fin structures is about 3/2 of the space between the n-type finstructure and the wall fin structure 50 at the center of the top of thefin structure.

In some embodiments, when n-type fin structures 12N are arranged withthe pitch P0, no wall fin structure 50 is formed between the finstructures as shown in FIG. 11B similar to the p-type fin structures 12Pwith a pitch P1 (=P0), as shown in FIG. 11A. When the p-type finstructures are arranged with a pitch greater than P0 (e.g., P2 or more),a wall fin structure or a wall structure is formed between the p-typefin structures.

FIGS. 12A, 12B, 12C and 12D show various stages of a sequentialmanufacturing operation of a semiconductor FET device according to anembodiment of the present disclosure. It is understood that additionaloperations may be provided before, during, and after the processes shownby FIGS. 12A-12D, and some of the operations described below can bereplaced or eliminated for additional embodiments of the method. Theorder of the operations/processes may be interchangeable. FIG. 13 showsa flow chart for forming the cap semiconductor layer 13.

FIG. 12A shows a structure after the channel regions are exposed byrecessing the first dielectric layer 30. For the purpose ofillustration, one n-type fin structure 12N and one p-type fin structure12P are shown in FIGS. 12A-12C.

In some embodiments, after the isolation insulating layer 30 is formedat S101 of FIG. 13 , one or more wet cleaning operations are performedin some embodiments. In some embodiments, a thin oxide layer formed onthe channel region of the fin structures 12 is removed. In someembodiments, the channel region of the fin structure exposed from theisolation insulating layer is also slightly etched.

Then, at S102 of FIG. 13 , in some embodiments, the channel region ofthe fin structures 12N, 12P are trimmed (etched), as shown in FIG. 12B.In some embodiments, one or more dry etching and/or wet etching areperformed. In some embodiments, a wet etching using atetramethylammonium hydroxide (TMAH) aqueous solution and/or a KOHaqueous solution is used as a wet etchant. In other embodiments, achemical dry etching using an HCl gas is used to trim the channelregion. In some embodiments, a trimming (etching) amount is in a rangefrom about 0.2 nm to about 2.0 nm and is in a range from about 0.5 nm toabout 1.0 nm in other embodiments.

After the trimming etching, in some embodiments, a cap semiconductorlayer 13 is formed over the channel region of the n-type fin structure12N and the channel region 11 of the p-type fin structure 12P, as shownin FIG. 12C.

In some embodiments, the cap semiconductor layer 13 includes silicon,SiGe or Ge. In certain embodiments, silicon is used. The capsemiconductor layer 13 is formed over the fin structures to adjustdimensions (widths) of the fin structures and also control out-diffusionof Ge from SiGe or Ge layers of the p-type fin structures. In someembodiments, the thickness of the cap semiconductor layer 13 (measuredat the 50% height of the channel region) is in a range from about 0.2 nmto about 4 nm and is in a range from about 0.5 nm to about 2 nm in otherembodiments, depending on device and/or process requirements.

In some embodiments, the cap semiconductor layer 13 is epitaxially-grownover the channel regions. In some embodiments, the epitaxial layer issubstantially selectively formed on the channel regions. In someembodiments, the cap semiconductor layer 13 is non-doped and in otherembodiments, the cap semiconductor layer 13 is appropriately doped forthe n-type fin structures 12N and p-type fin structures 12P.

In some embodiments of the present disclosure, just before the capsemiconductor layer 13 is epitaxially formed, a cleaning operation isperformed to remove an oxide layer formed in or after the trimmingprocess, at S103 of FIG. 13 . In some embodiments of the presentdisclosure, the selectivity of the epitaxial growth of the capsemiconductor layer 13 depends on conditions and/or processes of thecleaning operation.

In some embodiments of the present disclosure, the cleaning operationand the epitaxial growth operation are performed in a same processchamber (e.g., vacuum chamber or a furnace) (in-situ cleaning). In someembodiments, a furnace shown in FIG. 14 is used for the cleaningoperation and the epitaxial growth operation. As shown in FIG. 14 , thefurnace includes an outer tube and an inner tube and wafers are arrangedvertically inside the inner tube and are supported and moved verticallyby pedestal. A reaction gas flows from the bottom of the inner tube andflows down from the top of the inner tube to the exhaust through thespace between the inner tube and the outer tube. The furnace is heatedby the heaters disposed outside the outer tube. Multiple wafers (e.g.,25-100 wafers) can be processed at the same time in the furnace.

In some embodiments, the cleaning operation is a chemical dry etchingusing a mixed gas of HF, NH₃ and N₂. In some embodiments, a flow rateratio of HF, NH₃ and N₂ is about 1:1:2.75 to about 5:1:6.5. In someembodiments, no noble gas (He, Ar) is added. In some embodiments, nohydrogen gas is added. The cleaning or removal of silicon oxide by HFand NH₃ proceeds as follows: SiO₂+4HF→SiF₄+2H₂O;SiF₄+2HF+2NH₃→(NH₄)₂SiF₆; and SiO₂+6HF+2NH₃→(NH₄)₂SiF₆. Compared to achemical dry etching using a mixed gas of HF, NH₃ and He, (so calledSiCoNi process), the chemical dry etching using a mixed gas of HF, NH₃and N₂ etches silicon oxide (oxide on the channel region and isolationinsulating layer 30) and silicon nitride (liner dielectric layer 18)more equally than the SiCoNi process, which affects the selectivity ofthe epitaxial growth. In some embodiments, an etching selectivity of theisolation insulating layer 30 (e.g., silicon oxide) to the linerdielectric layer (e.g., silicon nitride) is about 1.4 when using themixed gas of HF, NH₃ and N₂ etches, while the etching selectivity isabout 3.5 when the SiCoNi process is used.

In some embodiments, the amount of HF and NH₃ (etchant gas) with respectto the total mixed gas is equal to or more than 30 vol % to equal to orless than 80 vol %, and in other embodiments, in a range from about 40vol % to about 60 vol %. If the amount of etchant gas is smaller thanthis range, the cleaning effect is insufficient and if the amount of theetchant gas is greater than this range, quartz parts of the furnace maybe damaged. In some embodiments, the pressure during the chemical dryetching is about 0.1 Torr to about 0.5 Torr.

FIG. 15 shows a temperature change from the cleaning operation to theepitaxial growth. In some embodiments, a temperature of the cleaningoperation is in a range from about 30° C. to about 100° C., and is in arange from about 40° C. to about 70° C. in other embodiments. If thetemperature is lower than the disclosed ranges, the cleaning effect isinsufficient and if the temperature is higher than the disclosed ranges,the removal of oxide may decrease (higher selective etching). A timeduration of the cleaning operation is in a range from about 1 min to 60min in some embodiments and is in a range from about 5 min to about 15min in other embodiments. When the cleaning time is too small, thecleaning effect is insufficient, and when the cleaning time to too long,the dielectric or insulating layers may be etched too much.

After the cleaning operation by the chemical dry etching, at S104 ofFIG. 13 , the etching byproduct (e.g., (NH₄)₂SiF₆) is removed by aheating process in a H₂ ambient (e.g., sublimation process:(NH₄)₂SiF₆→SiF₄+2HF+2NH₃). The temperature of the sublimation process isin a range from about 250° C. to about 350° C. in some embodiments. Atime duration of the sublimation process is in a range from about 1 hourto 5 hours in some embodiments.

After the sublimation process, a pre-baking process is performed in a H₂ambient at S105 of FIG. 13 . In some embodiments, the temperature of thepre-baking process is higher than the sublimation process. In someembodiments, the temperature of the pre-baking process is in a rangefrom about 300° C. to about 650° C., and is in a range from about 350°C. to about 400° C. in other embodiments. In the pre-baking process,fluorine is removed. A time duration of the pre-baking operation is in arange from about 30 min to 3 hours in some embodiments. In someembodiments, the sublimation process and the pre-baking process areperformed continuously at the same temperature.

After the pre-baking process, an epitaxial growth process is performedto form the cap semiconductor layer 13, at S106 of FIG. 13 . In someembodiments, a source gas is one or more of SiH₄ or Si₂H₆. Thetemperature of the epitaxial growth process is in a range from about300° C. to about 650° C. in some embodiments and is in a range fromabout 350° C. to about 400° C. in other embodiments. If the temperatureis too high, uniformity of the film thickness decreases, Ge in the SiGelayer diffuses, and selectivity is lower, and if the temperature is toolow, the growth rate is too low for mass production. In someembodiments, the temperature of the pre-baking is the same as ordifferent from the temperature of the epitaxial growth.

FIG. 12D shows a cross section view after the cap semiconductor layer 13is formed over the SiGe channel 11. As shown in FIG. 12D, the amount ofthe cap semiconductor layer 13 on the liner dielectric layer 18 (a wingportion) is minimized. In some embodiments, the cap semiconductor layer13 does not extend over the isolation insulating layer 30. In someembodiments, the surface area D3 of the liner dielectric layer 18 notcovered by the cap semiconductor layer 13 is about 20% to 90% of thethickness liner dielectric layer 18, and thus the thickness of the capsemiconductor layer 13 on the liner dielectric layer 18 (the wingportion) is about 10% to about 80% of the thickness D1 (D1, D2 and D3are measured in the horizontal direction (projected onto the horizontalplane)). In other embodiments, D3 is about 40% to 70% of D1 (thicknessof the cap semiconductor layer 13 on the liner dielectric layer 18 (thewing portion) is about 30% to about 60% of the thickness D1). In someembodiments, the dimension D1 is defined as a distance of e.g., 2.7 nm(the right line defining D1) from the outer side face (the let linedefining D1, interface between the liner dielectric layer 18 and theisolation insulating layer 30), and the thickness D2 of the capsemiconductor layer 13 is largest point of the cap semiconductor layer13 from the right line defining D1. In some embodiments, the D2 (wingwidth) is about 1.3 nm to about 2.3 nm. When the SiCoNi process and/orex-situ cleaning process are used, the cap semiconductor layer 13 fullycovers the liner dielectric layer and may be formed over the isolationinsulating layer beyond the liner dielectric layer 18. When the wingportion is larger, electrical properties of the FinFET (e.g., draininduced barrier lowering (DIBL)) become worse. In some embodiments, thethickness of the cap semiconductor layer 13 just on the liner dielectriclayer 18 is greater than the thickness of the cap semiconductor layer 13at the middle of the channel region (e.g., 50% of height of the channelregion).

As set forth above, the cleaning operation, the sublimation process, thepre-baking process and the epitaxial growth are continuously performedin the same chamber (furnace) without breaking vacuum. In someembodiments, the operations of FIG. 13 is repeated twice or three timesto obtain desired channel shape.

Although FIG. 12D shows a p-type fin structure (SiGe channel), the sameor similar structure can be obtained for an n-type fin structure (Sichannel).

After the cap semiconductor layer 13 is formed, an annealing operationis performed in some embodiments. In some embodiments, the annealingoperation includes rapid thermal annealing at a temperature in a rangefrom about 900° C. to about 1100° C. for about 0.1 sec to 10 sec. Inother embodiments, the temperature is in a range from about 950° C. to1050° C. In other embodiments, the time duration is in a range fromabout 0.5 sec to 5 sec. In some embodiments, the annealing operation isperformed in a mixed gas of N₂ and O₂, where the oxygen concentration isin a range from about 0.1% to 0.5%. The annealing operation is alsoperformed in the same chamber (furnace) in some embodiments.

FIGS. 16A-16F show various stages of a sequential manufacturingoperation of a semiconductor FET device according to an embodiment ofthe present disclosure. It is understood that additional operations maybe provided before, during, and after the processes shown by FIGS.16A-16F, and some of the operations described below can be replaced oreliminated for additional embodiments of the method. The order of theoperations/processes may be interchangeable.

FIG. 16A shows the structure after the cap semiconductor layer 13 isformed over both p-type fin structures 12P and n-type fin structures12N. Substantially no cap semiconductor layer is formed over a surfaceof insulating material, such as the surface of the isolation insulatinglayer 30 and a wall fin structure 50.

After the cap semiconductor layer 13 is formed as shown in FIGS.12A-12D, sacrificial gate structures 40 are formed over the finstructures, as shown in FIG. 16B. In some embodiments, the sacrificialgate structures 40 include a sacrificial dielectric layer, a sacrificialgate electrode layer and a hard mask layer. The sacrificial gatedielectric layer includes one or more layers of insulating material,such as a silicon oxide-based material. In one embodiment, silicon oxideformed by CVD is used. The thickness of the sacrificial gate dielectriclayer is in a range from about 1 nm to about 5 nm in some embodiments.The sacrificial gate electrode layer includes silicon such aspolycrystalline silicon or amorphous silicon. The thickness of thesacrificial gate electrode layer is in a range from about 100 nm toabout 200 nm in some embodiments. In some embodiments, the sacrificialgate electrode layer is subjected to a planarization operation. Thesacrificial gate dielectric layer and the sacrificial gate electrodelayer are deposited using CVD, including LPCVD and PECVD, PVD, ALD, orother suitable process. The hard mask layer is used to form thesacrificial gate electrode layer and includes one or more layers ofsilicon nitride and silicon oxide. In some embodiments, the sacrificialgate dielectric layer also covers the source/drain region of the finstructures 12P, 12N.

After the sacrificial gate structures 40 are formed, a blanket layer ofan insulating material for sidewall spacers is conformally formed byusing CVD or other suitable methods. The blanket layer is deposited in aconformal manner so that it has substantially equal thicknesses onvertical surfaces, such as the sidewalls, horizontal surfaces, and thetop of the sacrificial gate structure. In some embodiments, the blanketlayer is deposited to a thickness in a range from about 2 nm to about 10nm. In one embodiment, the insulating material of the blanket layer is asilicon nitride-based material, such as SiN, SiON, SiOCN or SiCN andcombinations thereof. The sidewall spacers are formed on oppositesidewalls of the sacrificial gate structures 40.

In the embodiment of FIG. 16B, one sacrificial gate structure 40 isdisposed over two fin structures 12P in the p-type region, and onesacrificial gate structure 40 is disposed over three fin structures 12Nand the wall fin structure 50 in the n-type region. However, the numberof the fin structures per sacrificial gate structure is not limited, andcan be one, two, three or more than four.

Subsequently, a source/drain epitaxial layer 62 and 64 is formed (see,FIG. 16F). In some embodiments, the fin structures of source/drainregions are recessed down below the upper surface of the isolationinsulating layer 30 by using dry etching and/or wet etching, and thenone or more semiconductor layers are epitaxially formed over therecessed fin structures. In other embodiments, one or more semiconductorlayers are epitaxially formed over the source/drain region of thenon-recessed fin structure. The source/drain epitaxial layer 62 for ann-type FET includes one or more layers of SiC, SiP and SiCP, and thesource/drain epitaxial layer 64 for a p-type FET includes one or morelayers of SiGe, SiGeSn, which may be doped with B. In at least oneembodiment, the epitaxial layers are epitaxially-grown by an LPCVDprocess, molecular beam epitaxy, atomic layer deposition or any othersuitable method. The LPCVD process is performed at a temperature ofabout 400° C. to about 850° C. and under a pressure of about 1 Torr toabout 200 Torr, using a silicon source gas such as SiH₄, Si₂H₆, orSi₃H₈; a germanium source gas such as GeH₄ or G₂H₆; a carbon source gassuch as CH₄ or SiH₃CH₃; a phosphorus source gas such as PH₃; and/or aboron source gas such as B₂H₆. In some embodiments, two or more layerswith different compositions (e.g., different P, C, Ge and/or Bconcentrations) are formed as the source/drain epitaxial layers.

Subsequently, a first interlayer dielectric (ILD) layer 55 is formedover the source/drain epitaxial layers and the sacrificial gatestructures 40, as shown in FIG. 16C. Then, a planarization operation,such as CMP, is performed, so that the top portion of the sacrificialgate electrode layer is exposed. The materials for the first ILD layer55 include compounds comprising Si, O, C and/or H, such as siliconoxide, SiCOH and SiOC. Organic materials, such as polymers, may be usedfor the first ILD layer 55.

Next, the sacrificial structure 40 including sacrificial gate electrodelayer and the sacrificial gate dielectric layer are removed, therebyexposing the upper portions (channel regions) of the fin structures, asshown in FIG. 16D. The sacrificial gate structures 40 can be removedusing plasma dry etching and/or wet etching. When the sacrificial gateelectrode layer is polysilicon and the first ILD layer 55 is siliconoxide, a wet etchant such as a TMAH solution can be used to selectivelyremove the sacrificial gate electrode layer. The sacrificial gatedielectric layer is thereafter removed using plasma dry etching and/orwet etching.

After the sacrificial gate structures are removed, a gate dielectriclayer 82 is formed over channel regions (upper portions of the finstructure above the isolation insulating layer 30), and a gate electrodelayer 84 is formed on the gate dielectric layer 82, as shown in FIG.16E.

In certain embodiments, the gate dielectric layer 82 includes one ormore layers of a dielectric material, such as silicon oxide, siliconnitride, or high-k dielectric material, other suitable dielectricmaterial, and/or combinations thereof. Examples of high-k dielectricmaterial include HfO₂, HfSiO, HfSiON, HfTaO, HfTiO, HfZrO, zirconiumoxide, aluminum oxide, titanium oxide, hafnium dioxide-alumina(HfO₂—Al₂O₃) alloy, other suitable high-k dielectric materials, and/orcombinations thereof. In some embodiments, the gate dielectric layer 82includes an interfacial layer formed between the channel layers and thedielectric material.

The gate dielectric layer 82 may be formed by CVD, ALD or any suitablemethod. In one embodiment, the gate dielectric layer 82 is formed usinga highly conformal deposition process such as ALD in order to ensure theformation of a gate dielectric layer having a uniform thickness overeach channel layers. The thickness of the gate dielectric layer 82 is ina range from about 1 nm to about 6 nm in one embodiment.

The gate electrode layer 84 is formed on the gate dielectric layer 82.The gate electrode 84 includes one or more layers of conductivematerial, such as polysilicon, aluminum, copper, titanium, tantalum,tungsten, cobalt, molybdenum, tantalum nitride, nickel silicide, cobaltsilicide, TiN, WN, TiAl, TiAlN, TaCN, TaC, TaSiN, metal alloys, othersuitable materials, and/or combinations thereof.

The gate electrode layer 84 may be formed by CVD, ALD, electro-plating,or other suitable method. The gate electrode layer is also depositedover the upper surface of the first ILD layer 55. The gate dielectriclayer and the gate electrode layer formed over the first ILD layer 55are then planarized by using, for example, CMP, until the top surface ofthe first ILD layer 55 is revealed. In some embodiments, after theplanarization operation, the gate electrode layer 84 is recessed and acap insulating layer is formed over the recessed gate electrode 84. Thecap insulating layer includes one or more layers of a siliconnitride-based material, such as SiN. The cap insulating layer can beformed by depositing an insulating material followed by a planarizationoperation.

In certain embodiments of the present disclosure, one or more workfunction adjustment layers (not shown) are interposed between the gatedielectric layer 82 and the gate electrode 84. The work functionadjustment layers are made of a conductive material such as a singlelayer of TiN, TaN, TaAlC, TiC, TaC, Co, Al, TiAl, HfTi, TiSi, TaSi orTiAlC, or a multilayer of two or more of these materials. For then-channel FET, one or more of TaN, TaAlC, TiN, TiC, Co, TiAl, HfTi, TiSiand TaSi is used as the work function adjustment layer, and for thep-channel FET, one or more of TiAlC, Al, TiAl, TaN, TaAlC, TiN, TiC andCo is used as the work function adjustment layer. The work functionadjustment layer may be formed by ALD, PVD, CVD, e-beam evaporation, orother suitable process. Further, the work function adjustment layer maybe formed separately for the n-channel FET and the p-channel FET whichmay use different metal layers.

It is understood that the semiconductor device shown in FIGS. 16E and16F undergoes further CMOS processes to form various features such ascontacts/vias, interconnect metal layers, dielectric layers, passivationlayers, etc.

FIGS. 17A and 17B show advantageous effects of the present embodiments.FIG. 17A shows a Ge concentration from the surface of the capsemiconductor layer in a p-type fin structure. In the presentembodiments, a steep slope in the Ge concentration was observed, whichmeans that undesired Ge diffusion from the SiGe layer 11 to the capsemiconductor layer (Si) was effectively suppressed. In someembodiments, the diffusion can be suppressed by about 1.5-2.5 nm.Further, as shown in FIG. 17B, in the present embodiments, oxygencontamination into the channel region was suppressed. In someembodiments, the concentration of oxygen is smaller than about 1×10¹⁸atoms/cm³. In some embodiments, the concentration of oxygen is smallerthan the detection limit or more than about 1×10¹⁶ atoms/cm³.

FIGS. 18A and 18B show cross sectional views of the semiconductor deviceaccording to embodiments of the present disclosure.

As shown in FIG. 18A, a wall fin structure 50 is disposed between finstructures where a space therebetween is sufficiently large, while nowall fin structure is disposed between fin structures where a spacetherebetween is sufficiently small. In some embodiments, the channelregion of the fin structure bends and does not have uniform widthdepending on device performance requirements. In some embodiments,widths of the wall fin structure are greater than the widths of thesemiconductor fin structures and different from each other. The heightof the top of the third dielectric layer 40 differs from each otherdepending on space widths between adjacent fin structures. The height ofthe bottom of the third dielectric layer 40 differs from each otherdepending on space widths between adjacent fin structures.

As shown in FIG. 18B, the wing portions of the cap semiconductor layer13 are formed asymmetric with respect to the center of the finstructure. In some embodiments, the lateral protruding amounts of thewing portions to the right and the left are different from each other.In some embodiments, the height of the maximum protruding portion of thewing portions are different from each other.

It will be understood that not all advantages have been necessarilydiscussed herein, no particular advantage is required for allembodiments or examples, and other embodiments or examples may offerdifferent advantages.

In accordance with one aspect of the present disclosure, in a method ofmanufacturing a semiconductor device, a fin structure having a channelregion protruding from an isolation insulating layer disposed over asemiconductor substrate is formed, a cleaning operation is performed,and an epitaxial semiconductor layer is formed over the channel region.The cleaning operation and the forming the epitaxial semiconductor layerare performed in a same chamber without breaking vacuum. In one or moreof the foregoing or the following embodiments, the cleaning operation isa chemical dry etching using a mixed gas of HF, NH₃ and N₂. In one ormore of the foregoing or the following embodiments, the cleaningoperation is performed at a temperature in a range from 30° C. to 100°C. In one or more of the foregoing or the following embodiments, thecleaning operation is performed for a time duration in a range from 5min to about 15 min. In one or more of the foregoing or the followingembodiments, a sublimation operation is further performed between thecleaning operation and the forming the epitaxial semiconductor to removeby-products of the cleaning operation. In one or more of the foregoingor the following embodiments, the sublimation operation is performed ata temperature higher than the cleaning operation and lower than theepitaxial growth. In one or more of the foregoing or the followingembodiments, the sublimation operation is performed in a H₂ ambient.

In accordance with another aspect of the present disclosure, in a methodof manufacturing a semiconductor device, a fin structure is formed. Thefin structure has a channel region protruding from an isolationinsulating layer disposed over a semiconductor substrate and a bottomregion embedded in the isolation insulating layer. The channel region ismade of SiGe and the bottom region is made of Si, a liner dielectriclayer is disposed between the bottom region and the isolation insulatinglayer, and a top of the liner dielectric layer is exposed from theisolation insulating layer. A cleaning operation is performed on thechannel region, the isolation insulating layer and the liner dielectriclayer, and an epitaxial semiconductor layer is formed over the channelregion. The cleaning operation and the forming the epitaxialsemiconductor layer are performed in a same chamber without breakingvacuum. In one or more of the foregoing or the following embodiments,the epitaxial semiconductor layer only partially covers the exposed topof the liner dielectric layer. In one or more of the foregoing or thefollowing embodiments, a thickness of the epitaxial semiconductor on theliner dielectric layer is 10% to 80% of a thickness of the linerdielectric layer at the top of the liner dielectric layer. In one ormore of the foregoing or the following embodiments, the epitaxialsemiconductor layer is a Si layer. In one or more of the foregoing orthe following embodiments, the liner dielectric layer includes siliconnitride, and the isolation insulating layer includes silicon oxide. Inone or more of the foregoing or the following embodiments, the formingthe epitaxial semiconductor layer is performed at a temperature in arange from 350° C. to 400° C. In one or more of the foregoing or thefollowing embodiments, the cleaning operation is a chemical dry etchingusing a mixed gas of HF, NH₃ and N₂, at a temperature in a range from40° C. to 70° C. In one or more of the foregoing or the followingembodiments, no noble gas is added to the mixed gas. In one or more ofthe foregoing or the following embodiments, the chamber is a furnace inwhich multiple substrate are processed at the same time.

In accordance with another aspect of the present disclosure, in a methodof manufacturing a semiconductor device, a first dielectric layer isformed over a first pair of semiconductor fins and a second pair ofsemiconductor fins such that the first dielectric layer fills a spacebetween the second pair of semiconductor fins. A second dielectric layeris formed over the first dielectric layer such that the seconddielectric layer fills a space between the first pair of semiconductorfins. The second dielectric layer is recessed below a top of each of thefirst pair of semiconductor fins. A third dielectric layer is formedover the recessed second dielectric layer. The third dielectric layer isrecessed below the top of the first pair of semiconductor fins. A fourthdielectric layer is formed over the recessed third dielectric layer. Thefourth dielectric layer and the first dielectric layer are recessedbelow the top of the first pair of semiconductor fins, thereby forming awall fin disposed between the first pair of semiconductor fins. Acleaning operation is performed, and an epitaxial semiconductor layer isformed over channel regions of the first and second pairs ofsemiconductor fins. The cleaning operation and the forming the epitaxialsemiconductor layer are performed in a same chamber without breakingvacuum. In one or more of the foregoing or the following embodiments,the wall fin comprises the recessed fourth dielectric layer, therecessed third dielectric layer and the recessed second dielectric layerdisposed under the recessed third dielectric layer. In one or more ofthe foregoing or the following embodiments, no wall fin is formedbetween the second pair of semiconductor fins. In one or more of theforegoing or the following embodiments, the channel regions of the firstpair of semiconductor fins are made of Si, and the channel regions ofthe second pair of semiconductor fins are made of SiGe.

In accordance with another aspect of the present disclosure, asemiconductor device includes a semiconductor fin disposed over asemiconductor substrate and extending in a first direction. Thesemiconductor fin includes a channel region and a bottom region on whichthe channel region is disposed. The semiconductor device includes aliner dielectric layer disposed on side walls of the bottom region, anisolation insulating layer from which the channel region protrudes andin which the bottom region is embedded, and a gate structure disposedover the channel region of the semiconductor fin and extending in asecond direction crossing the first direction. A cap semiconductor layeris disposed on the channel region, and a top of the liner dielectriclayer is only partially covered by the cap semiconductor layer. In oneor more of the foregoing or the following embodiments, the channelregion and the bottom region are made of different semiconductormaterials from each other. In one or more of the foregoing or thefollowing embodiments, the channel region is made of SiGe. In one ormore of the foregoing or the following embodiments, the capsemiconductor layer is made of Si. In one or more of the foregoing orthe following embodiments, a thickness of the cap semiconductor layer onthe liner dielectric layer is 30% to 70% of a thickness of the linerdielectric layer at the top of the liner dielectric layer. In one ormore of the foregoing or the following embodiments, the liner dielectriclayer includes silicon nitride, and the isolation insulating layerincludes silicon oxide. In one or more of the foregoing or the followingembodiments, a thickness of the cap semiconductor layer on the linerdielectric layer is greater than a thickness of the cap semiconductorlayer at a 50% height of the channel region. In one or more of theforegoing or the following embodiments, the channel region is made ofSi, the cap semiconductor layer is made of Si, and a thickness of thecap semiconductor layer on the liner dielectric layer is 30% to 70% of athickness of the liner dielectric layer at the top of the linerdielectric layer.

In accordance with another aspect of the present disclosure, asemiconductor device includes a first semiconductor fin and a secondsemiconductor fin disposed over a semiconductor substrate and extendingin a first direction. Each of the first and second semiconductor finsincludes a channel region and a bottom region on which the channelregion is disposed. The semiconductor device includes a liner dielectriclayer disposed on side walls of the bottom region of each of the firstand second semiconductor fins, an isolation insulating layer from whichthe channel region of the first and second semiconductor fins protrudesand in which the bottom region of the first and second semiconductorfins is embedded, and a first gate structure disposed over the channelregion of the first semiconductor fin and a second gate structuredisposed over the channel region of the second semiconductor fin. A capsemiconductor layer is disposed on the channel region of each of thefirst and second semiconductor fins, and a top of the liner dielectriclayer is only partially covered by the cap semiconductor layer at eachof the first and second semiconductor fins. In one or more of theforegoing or the following embodiments, the cap semiconductor layer ismade of Si. In one or more of the foregoing or the followingembodiments, the channel region of the second semiconductor fin is madeof SiGe. In one or more of the foregoing or the following embodiments,the channel region of the first semiconductor fin is made of Si. In oneor more of the foregoing or the following embodiments, a thickness ofthe cap semiconductor layer of on the liner dielectric layer at thesecond semiconductor fin is 30% to 70% of a thickness of the linerdielectric layer at the top of the liner dielectric layer. In one ormore of the foregoing or the following embodiments, the liner dielectriclayer includes silicon nitride, and the isolation insulating layerincludes silicon oxide. In one or more of the foregoing or the followingembodiments, a thickness of the cap semiconductor layer on the linerdielectric layer is greater than a thickness of the cap semiconductorlayer at a 50% height of the channel region. In one or more of theforegoing or the following embodiments, a wall fin structure made of atleast three different dielectric material is disposed between the firstsemiconductor fin and the second semiconductor fin.

In accordance with another aspect of the present disclosure, asemiconductor device includes a first semiconductor fin and a secondsemiconductor fin disposed over a semiconductor substrate and extendingin a first direction, an isolation insulating layer disposed between thefirst semiconductor fin and the second semiconductor fin, a wall finextending in the first direction, wherein a lower portion of the wallfin is embedded in the isolation insulating layer and a upper portion ofthe wall fin protrudes from the isolation insulating layer, and a gatestructure disposed over a channel region of the first semiconductor finand a channel region of the second semiconductor fin and extending in asecond direction crossing the first direction. Each of the firstsemiconductor fin and the second semiconductor fin includes the channelregion and a bottom region embedded in the isolation insulating layerand a liner dielectric layer disposed between the isolation insulatinglayer and the bottom region, the channel region is made of SiGe andfurther includes a Si cap layer disposed over the SiGe channel region,and a top of the liner dielectric layer is only partially covered by theSi cap layer. In one or more of the foregoing or the followingembodiments, a thickness of the Si cap layer on the liner dielectriclayer is 30% to 70% of a thickness of the liner dielectric layer at thetop of the liner dielectric layer. In one or more of the foregoing orthe following embodiments, the liner dielectric layer includes siliconnitride, and the isolation insulating layer includes silicon oxide. Inone or more of the foregoing or the following embodiments, the wall finincludes a lower dielectric layer and an upper dielectric layer disposedover the lower dielectric layer and made of a different material thanthe lower dielectric layer, and the upper dielectric layer includesincludes at least one selected from the group consisting of HfO₂, HfSiO,HfSiON, HfTaO, HfSiO, HfZrO, zirconium oxide, aluminum oxide, titaniumoxide, and a hafnium dioxide-alumina (HfO₂—Al₂O₃) alloy.

The foregoing outlines features of several embodiments or examples sothat those skilled in the art may better understand the aspects of thepresent disclosure. Those skilled in the art should appreciate that theymay readily use the present disclosure as a basis for designing ormodifying other processes and structures for carrying out the samepurposes and/or achieving the same advantages of the embodiments orexamples introduced herein. Those skilled in the art should also realizethat such equivalent constructions do not depart from the spirit andscope of the present disclosure, and that they may make various changes,substitutions, and alterations herein without departing from the spiritand scope of the present disclosure.

What is claimed is:
 1. A method of manufacturing a semiconductor device,comprising: forming a fin structure having a channel region protrudingfrom an isolation insulating layer disposed over a semiconductorsubstrate; performing a cleaning operation; and forming an epitaxialsemiconductor layer over the channel region by an epitaxial growthprocess, wherein: the epitaxial growth process is performed such thatthe epitaxial semiconductor layer is not formed over the isolationinsulating layer during the epitaxial growth process, the cleaningoperation and the forming the epitaxial semiconductor layer areperformed in a same chamber without breaking vacuum, the cleaningoperation is a chemical dry etching using a mixed gas of HF, NH₃ and N₂,and a flow rate ratio of HF, NH₃ and N₂ is 1:1:2.75 to 5:1:6.5.
 2. Themethod of claim 1, wherein a pressure during the chemical dry etching is0.1 Torr to 0.5 Torr.
 3. The method of claim 1, wherein the cleaningoperation is performed at a temperature in a range from 30° C. to 100°C.
 4. The method of claim 1, wherein the cleaning operation is performedfor a time duration in a range from 5 min to 15 min.
 5. The method ofclaim 1, further comprising performing a sublimation operation betweenthe cleaning operation and the forming the epitaxial semiconductor layerto remove by-products of the cleaning operation.
 6. The method of claim5, wherein the sublimation operation is performed at a temperaturehigher than the cleaning operation and lower than the forming theepitaxial semiconductor layer.
 7. The method of claim 5, wherein thesublimation operation is performed in a H₂ ambient.
 8. A method ofmanufacturing a semiconductor device, comprising: forming a finstructure having a channel region protruding from an isolationinsulating layer disposed over a semiconductor substrate and a bottomregion embedded in the isolation insulating layer, wherein the channelregion is made of SiGe and the bottom region is made of Si, a linerdielectric layer disposed between the bottom region and the isolationinsulating layer, and a top of the liner dielectric layer exposed fromthe isolation insulating layer; performing a cleaning operation on thechannel region, the isolation insulating layer and the liner dielectriclayer; and forming an epitaxial semiconductor layer over the channelregion by using an epitaxial growth process, wherein the cleaningoperation and the forming the epitaxial semiconductor layer areperformed in a same chamber without breaking vacuum, and the epitaxialgrowth process is performed such that the epitaxial semiconductor layeras formed only partially covers the exposed top of the liner dielectriclayer and is not formed over the isolation insulating layer during theepitaxial growth process.
 9. The method of claim 8, wherein the cleaningoperation is a chemical dry etching using a mixed gas of HF, NH₃ and N₂,at a temperature in a range from 40° C. to 70° C.
 10. The method ofclaim 8, wherein a thickness of the epitaxial semiconductor on the linerdielectric layer as formed is 10% to 80% of a thickness of the linerdielectric layer at the top of the liner dielectric layer.
 11. Themethod of claim 8, wherein the epitaxial semiconductor layer is a Silayer.
 12. The method of claim 8, wherein the liner dielectric layerincludes silicon nitride, and the isolation insulating layer includessilicon oxide.
 13. The method of claim 8, wherein the forming theepitaxial semiconductor layer is performed at a temperature in a rangefrom 350° C. to 400° C.
 14. The method of claim 9, wherein an amount ofHF and NH₃ with respect to a total amount of the mixed gas is equal toor more than 30 vol % to equal to or less than 80 vol %.
 15. The methodof claim 9, wherein no noble gas is added to the mixed gas.
 16. Themethod of claim 8, wherein the chamber is a furnace in which multiplesubstrates are processed at the same time.
 17. A method of manufacturinga semiconductor device, comprising: forming a first dielectric layerover a first pair of semiconductor fins and a second pair ofsemiconductor fins such that the first dielectric layer fills a spacebetween the second pair of semiconductor fins; forming a seconddielectric layer over the first dielectric layer such that the seconddielectric layer fills a space between the first pair of semiconductorfins; recessing the second dielectric layer below a top of each of thefirst pair of semiconductor fins; forming a third dielectric layer overthe recessed second dielectric layer; recessing the third dielectriclayer below the top of the first pair of semiconductor fins; forming afourth dielectric layer over the recessed third dielectric layer;recessing the fourth dielectric layer and the first dielectric layerbelow the top of the first pair of semiconductor fins, thereby forming awall fin disposed between the first pair of semiconductor fins;performing a cleaning operation; and forming an epitaxial semiconductorlayer over channel regions of the first and second pairs ofsemiconductor fins, wherein the cleaning operation and the forming theepitaxial semiconductor layer are performed in a same chamber withoutbreaking vacuum, and the wall fin comprises the recessed fourthdielectric layer, the recessed third dielectric layer and the recessedsecond dielectric layer disposed under the recessed third dielectriclayer.
 18. The method of claim 17, wherein the fourth dielectric layerincludes hafnium oxide.
 19. The method of claim 17, wherein no wall finis formed between the second pair of semiconductor fins.
 20. The methodof claim 17, wherein the channel regions of the first pair ofsemiconductor fins are made of Si, and the channel regions of the secondpair of semiconductor fins are made of SiGe.